An infrared cut-off filter is an optical filter that allows visible light to be filtered through to remove infrared light. Mainly used in mobile phones, cameras, car, PC, tablet computers, security monitoring and other imaging camera core optical components applications. With the rapid development of consumer electronics, infrared cut-off filters have become the largest subordinate track in the filter industry.
In recent years, the main areas of product innovation by mobile phone manufacturers are camera equipment, screens, wireless charging and other fields, and the performance in the field of cameras is the increase in the number of cameras, from the beginning of a single camera to four cameras, five cameras. Cameras, car cameras from the beginning of two to now more than ten, the increase in the number of cameras to the infrared cut-off filter market demand has brought a great role in promoting.
The increase in market demand for infrared cut-off filters has also allowed equipment processing manufacturers to take the wind. The application of filter is small, the processing equipment requirements are high, and the green picosecond laser cutting function can meet the processing needs of infrared cut-off filter. Green light wavelength of 532nm, visible light, can be filtered through the coating layer, the use of objective lens or wire, can be focused in the glass layer, destroy the internal stress of the glass, so as to achieve the purpose of cutting.
In infrared cut-off filter processing, laser cutting machine has an important role, laser cutting machine advantages:
1, non-contact processing: laser processing only laser beam and workpiece contact, no cutting force for cutting parts, to avoid damage to the surface of the processed material.
2, high processing precision, low thermal effect: pulsed laser can achieve high instantaneous power, high energy density and low average power, can be completed instantaneously and the heat affected area is very small, to ensure high precision processing, small heat affected area.
3, high processing efficiency, good economic benefits: laser processing efficiency is often several times the mechanical processing effect and no consumables pollution-free. Laser invisible cutting technology of semiconductor wafer is a new laser cutting process, which has many advantages such as fast cutting speed, no dust generation, no cutting substrate loss, small cutting path required, and complete dry process.
4, according to the position of the circular sample, use the cutting head to cut 4 straight lines around each circular sample for auxiliary segments. Focusing into bessel beam, the filter is cut at a certain point spacing, and cracks can be formed between points. Finally, the film spreading cracks are carried out to complete the cutting of the filter. The edge breakage of the filter cut by this cutting method is small, which effectively improves the yield of the cutting filter and improves the cutting efficiency.
Laser cutting machine is currently the best cutting tool, with the increasing requirements for equipment in various industries, but also affected by various industries, the demand continues to rise.
Post time: Oct-21-2024
